CHENGDU Dec. 13 (NBD) -- The signing ceremony of strategic cooperation between Chengdu Municipal People's Government, Tsinghua Unigroup and New H3C Group was held on Monday in Southwest China's Chengdu.
Chengdu entered into agreements with the world-leading providers of IT solutions. The total investment for integrated circuit (IC) segement program under Tsinghua Unigroup is estimated to reach 200 billion yuan (about 28.99 billion U.S. dollars). Chengdu and Tsinghua Unigroup will collaborate to develop an industry chain spanning IC manufacturing, research, development and design, as well as IC industry fund operation.
Based on the agreement, New H3C is to establish its cloud computing headquarter and research & development center in Chengdu. The program is expected to speed up the development of electronic information industry across Sichuan Province